THERMINIC Workshop in Lecco was a big success!
This year’s 25th edition of the International Workshop on Thermal Investigation of ICs and Systems (THERMINIC 2019) marked a new milestone in the area of thermal issues in electronic components. The three-day event in Lecco, Italy, was attended by more than 120 conference delegates from 23 countries with a wide range of backgrounds in technology development and industrial management. Together the participants contributed 3 keynote speeches, 43 oral and 27 poster presentations, a short course preceding the event and immeasurable know-how and experience during the discussions and networking sessions.
A real highlight was a boat trip around the beautiful lake Como followed by the gala dinner at the “Il Griso” restaurant in Malgrate where the participants had the opportunity to discuss the day’s presentations and network in a relaxed atmosphere.
You can revisit highlights from the conference in our online photo gallery.
Our congratulations go to the winners of the Best Paper Award (Lorenzo Codecasa and his colleagues from Politecnico di Milano and Università Federico II, for their work on “Algorithm for Establishing the Dependence of Structure Functions on Spatial Distributions of Thermal Properties”) and Best Poster Award (Sreyash Sarkar and his colleagues from Université Paris-Est, for their work on “Effects of Doping on the Morphology and Infrared Radiative Properties of Black Silicon”) – congrats, everybody!
The organizers would like to thank our keynote speakers and all speakers, poster presenters, session chairs, exhibitors and sponsors for the part they played in this truly memorable event. We hope to see you all again at THERMINIC 2020 in Berlin.