Welcome to THERMINIC 2019!
THERMINIC is the major European Workshop related to thermal issues in electronic components and systems. For academics and industrialists involved in both micro and power electronics this annual event promises to be a very special occasion with a high quality technical program and exciting social events. We invite delegates to consider submitting abstracts that are related to, but not limited to, the following topics:
- Thermal Phenomena, Simulation and Experiment
- Electronics Cooling Concepts
- Thermo-Mechanical Reliability
If you are an Author and you wish to submit an abstract describing recent work, please check the Submissions page for details.
The deadline for abstract submission is April 16!
The 25th edition of Therminic will be held in the city of Lecco, encased in the charming scenery of Lake Como, Italy. Politecnico di Milano will act as hosting institution and provide the conference with the vibrant context of its university campus and research facilities. Besides, the forthcoming 25th edition holds a symbolic and strategic value: it will be a special occasion to get an insight to the latest advancements in the field nano and power electronics and to draw a retrospect to the last decades of research along with an outlook to future directions. Carefully selected contributions and special social events, will also provide an opportunity to share knowledge and experiences in the exclusive scenery of Lake Como.
We look forward to seeing you all at Therminic 2019 in Lecco.
Therminic 2019 Program Chair
Politecnico di Milano
Piazza Leonardo da Vinci 32 | 20133 Milano | Italy