Submission

Key dates in the submission process:

Notification of acceptance:  June 20, 2019
Submission of full paper: August 07, 2019


Publication through IEEE Xplore

Accepted contributions will be published in the Workshop proceedings, and archived in IEEE Xplore (provided they comply with specifications). THERMINIC papers can be searched through IEEE, Scopus, Google Scholar and other engines.


Special Issue of the Energies Journal

As a follow-up to the 24th THERMINIC Workshop, held in Stockholm in September 2018, a special issue of the Energies Journal about „Thermal and Electro-thermal System Simulation“ will be co-edited by Prof. Marta Rencz and Prof. Lorenzo Codecasa.

This special issue will target the presentation of the newest research results of thermal effects in electronics today, from characterization to multi-physics simulation, cooling solutions and reliability assessment.

The deadline for submission has just been extended to April 29, 2019. 

More Information:

https://www.mdpi.com/journal/energies/special_issues/thermal_electro_thermal_system


Contact In case you experience any problems with the submission process, please contact us at therminic@mcc-events.de