Full Paper Submission
All authors are required to submit a full paper to Therminic 2019. The recommended length is six pages for oral and four pages for poster presenters. The papers will be made available after the conference through the IEEE Xplore data base.
The deadline for all uploads: August 07, 2019
You need to submit:
- Your full paper in pdf format
- Your full paper in .doc or .docx format
Please download the full paper template here. (.docx/ 63KB)
Please log into the conference system to upload your final paper. While you are uploading the paper, you will also be asked to identify the presenting author and to provide a short bio of him or her for the session chair.
This year we will ask you to grant the copyright to IEEE Xplore electronically during the submission process.
Presentation Guide for Oral Presenters
There is no template for the presentation. Speakers are kindly asked to see the session chair 10 minutes before the session and to bring their presentation on a stick, a laptop will be provided.
Presentation Guide for Poster Presenters
Please bring your printed poster to the conference. The format should be A0 (84.1 x 118.9 cm, portrait style). There is no template for the poster, but please try to be simple and direct in your presentation. Use short phrases and “bulleted” text throughout and avoid long narrative paragraphs. Assistance for hanging the posters will be available. Poster must be hung with the tape provided in the poster room. All posters should hang by lunchtime on the poster presentation day and must be picked up by Friday morning. Posters that have not been picked up will not be kept.
Publication through IEEE Xplore
Accepted contributions will be published in the Workshop proceedings, and archived in IEEE Xplore (provided they comply with specifications). THERMINIC papers can be searched through IEEE, Scopus, Google Scholar and other engines.
Special Issue „Thermal and Electro-thermal System Simulation 2020“
As a follow-up to the 25th THERMINIC Workshop, held in Lecco in September 2019, a Special Issue of energies about thermal and multi-physical investigations electronics systems will be edited by Prof. Marta Rencz, Prof. Lorenzo Codecasa and Prof. Andras Poppe.
This Special Issue will target the presentation of the newest research results of thermal effects in electronics today, from characterization to through multi-physics simulation to cooling solutions and reliability assessment.
This special issue is not only collecting papers from the 25th THERMINIC Workshop, but also will containing papers from other scholars who interested in this topic. Papers that were presented at THERMINIC must be revised and contain at least 60% new material that has never been presented before.
Contact In case you experience any problems with the submission process, please contact us at firstname.lastname@example.org