Submission


Abstract Submission

Authors are invited to submit an abstract describing recent work from the realm of thermal investigations. Abstracts must detail the objectives of the work presented and demonstrate new results. All abstracts will be double-blind reviewed. Please use our online tool to submit your abstract to THERMINIC 2019. For details please check the call for papers.

Downloads

Call for Papers:

Call for papers (.pdf/ 215KB)

Template for Abstract Submission:

Therminic2019_Abstract_Template (zip/ 350KB)

Submit your abstract here
(you will be redirected to: https://www.conftool.pro/therminic2019 – abstract management system)


Key dates in the submission process:

Deadline abstract submission: April 16, 2019
Notification of acceptance:  June 20, 2019
Submission of full paper: August 07, 2019


Publication through IEEE Xplore

Accepted contributions will be published in the Workshop proceedings, and archived in IEEE Xplore (provided they comply with specifications). THERMINIC papers can be searched through IEEE, Scopus, Google Scholar and other engines.


Special Issue of the Energies Journal

As a follow-up to the 24th THERMINIC Workshop, held in Stockholm in September 2018, a special issue of the Energies Journal about „Thermal and Electro-thermal System Simulation“ will be co-edited by Prof. Marta Rencz and Prof. Lorenzo Codecasa.

This special issue will target the presentation of the newest research results of thermal effects in electronics today, from characterization to multi-physics simulation, cooling solutions and reliability assessment.

The deadline for submission has just been extended to April 29, 2019. 

More Information:

https://www.mdpi.com/journal/energies/special_issues/thermal_electro_thermal_system


Contact In case you experience any problems with the submission process, please contact us at therminic@mcc-events.de